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05/06/2018 - 07/06/2018 / Foire

SMT Hybrid Packaging

Allemagne, Nuremberg / NürnbergMesse, Halle 5, Stand 434 (LPKF Laser & Electronics AG)
SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics.
 
Part of it is the Future Packaging Joint Booth organized by Fraunhofer IZM. Its live production line provides a unique glimpse of the manufacturing process and the technologies that make it possible. Visitors get to judge the performance of the machines for themselves by seeing them in operation in an environment that mimics actual manufacturing conditions.

LPKF participates in the production line and presents its laser-depaneling system LPKF MicroLine 2000.

 


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