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LPKF Fusion3D 1200

LPKF Fusion3D 1200

Flexible and efficient Production of 3D molded interconnect devices

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Description
The LPKF Fusion3D 1200 laser system has been developed as a flexible solution for a broad range of requirements for the laser direct structuring. Equipped with a rotary indexing table, small, medium and large series of 3D molded interconnect devices (MID) can be produced in a particularly economical fashion.

With different laser processing units, an optional vision system and optional turning devices on the rotary indexing table, the system can be adapted to the end customers layout and performance requirements.

Less non-productive time, easier loading

The integrated rotary indexing table reduces non-productive times: While a component is being processed, another one can already be loaded or unloaded. Each table side can handle a separate project. Thanks to the height control of the rotary indexing table, manufacturing errors during project changes can be prevented.

Both table sides feature four separate I/O ports and can be supplied with vacuum and compressed air. A light barrier provides an active access protection.

The modular laser concept allows the Fusion3D platform to be equipped with several processing units (PU). A maximum of three PUs can work simultaneously and thereby guarantee short cycle times.

Pictures
LPKF Fusion3D 1200
LPKF Fusion3D 1200 with rotary indexing table and vision system
LPKF Fusion3D 1200 structuring area
Structuring area up to 200 mm x 200 mm x 80 mm
Laser Direct Structuring of a 3D-MID
Laser Direct Structuring of 3D MIDs with up to three processing units


3D MID (Molded Interconnect Device)
Finger tips for a robot hand (Source: Citec, Bielefeld University)

Video



Technical Data
Données techniques: Fusion3D 1200
Classe de láser 1
Zone de gravure (X/Y/Z) 200 mm x 200 mm x 80 mm  ou
100 mm x 100 mm x 40 mm
Nombre d’unités de traitement (PU) 1 - 3
Précision* ± 25 μm (± 1 mil)
Vitesse max. de gravure 4 000 mm/s
Formats des données d’entrée IGES, STEP
Logiciels LPKF CircuitPro3D
Longueur d’onde du laser 10 kHz – 200 kHz
Dimensions de la machine (Largeur x Hauteur x Profondeur) 956 mm x 1 880 mm x 1 642 mm
Poids de la machine Approx. 675 kg **
Conditions de fonctionnement
Alimentation électrique 400 V, 3L + N + PE, 16 A, 50/60 Hz, ~ 2.2 kVA
Refroidissement Refroidi à l'air
Conditions de fonctionnement
    Refroidissement Refroidi à l'air
    Température ambiante 22,5° C ± 2,5° C
    Humidité Max. 60 %
    Logiciel LPKF CircuitPro3D
Dispositif d’évacuation Exigé ; disponible comme une option
Matières à usiner (sélection) Nickel, cuivre, inox, plastiques LDS, LDS poudre et les peintures en aérosol, or et argent de pâte, de la céramique, étain

* Calibrated scanfield
** Including 3 Processing Units (PU), ecluding exhaust unit




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