Produits > Technologie de dégrappage de circuits imprimés > MicroLine 2000 S

LPKF MicroLine 2000 S

LPKF MicroLine 2000 S

Precision Cutting for Printed Circuit Boards and Cover Layers

Vous êtes ici: Produits > Technologie de dégrappage de circuits imprimés > MicroLine 2000 S
The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

Process advantages due to LPKF MicroLine 2000 systems

Compared to conventional tools, laser processing offers a compelling series of advantages.
  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

MicroLine 2000 S - Cutting Assembled Circuit Boards

The UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate.

  • Circuit board thickness up to 1.6 mm
  • Close to strip conductors or components
  • Optimal utilization of the substrate

Integration in MES Solutions

The MicroLine 2000 S seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

LPKF MicroLine 2000
Cutting PCBs and cover layers with the LPKF MicroLine 2000 systems.
Scoring, drilling and cutting of fired ceramics
Cutting, drilling and engraving of unfired ceramic (green tape).
Highly precise structuring of metal layers on ceramics

Processing of TCO/ITO layers without impairment of substrate
Each laser pulse removes an exactly defined amount of material. Depths can thus be precisely controlled.
LPKF MicroLine 2000 S PCB Rigid Flex
The UV laser separates flexible from rigid PCB components.
LPKF MicroLine 2000 S PCB Depaneling (Minimal Cutting Channels)
Minimal cutting channels allow a better depaneling.

LPKF MicroLine 2000 S PCB Depaneling (Close Cutting)
The UV laser cuts closely to the edge of components and circuit paths.
LPKF MicroLine 2000 S PCB Depaneling (1.6 mm)
Depending on the laser source, LPKF cutting systems can separate PCBs up to a thickness of 1.6 mm.


Technical Data
LPKF MicroLine 2000 S
Classe de láser 1
Zone de travail max.
(X x Y x Z)
350 mm x 350 mm x 11 mm
Zone de reconnaissance max.
(X x Y x Z)
300 mm x 300 mm
Formats de saisie des données Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Vitesse max. de gravure Selon l’application
Précision ± 25 μm
Diamètre du faisceau laser focalisé 20 μm
Longueur d’onde du laser 355 nm
Dimensions du système
875 mm x 1 530 mm x 1 300 mm
Poids ~ 450 kg
Conditions de fonctionnement
Alimentation électrique
230 V, 50 - 60 Hz, 3 kVA
Refroidi par air (cycle de refroidissement interne)
Température ambiante
22 °C ± 2 °C @ ± 25 μm /
22 °C ± 6 °C @ ± 50 μm
< 60 % (sans condensation)
Accessoires requis
Dispositif d’évacuation

* Hauteur incl. Voyant d'état = 2 020 mm

MicroLine 2000 S series systems feature multiple variations:
MicroLine 2120 S (10 watt laser source) and MicroLine 2820 S (15 watt laser source).

Brochure LPKF MicroLine 2000 S
PDF download

More Information

Sites du groupe LPKF
LPKF WeldingQuipment
LPKF SolarQuipment
ZelFlex Stretching Frames